2018
Ramping of LED burn-in and test.
2017
Transition from ISO/TS 16949:2009 to IATF 16949. Working towards Smart Burn In System
2016
Started High Power LED burn-in service for automotive lighting application
2013
Accredited with ISO14001:2004 Environmental Management System
2011
Started LED Test and Backend manufacturing service
2006
Upgraded to ISO/TS 16949:2002 certification. Started Sensor Module
Assembly used in printer
2003
Upgraded to ISO 9001:2000 certification. Started Chip-On-Board
assembly service
2001
Accredited with QS 9000 Quality Management System. Started LED
Lighting Assembly using Metal Core PCB
1998
Increase build up area to 125k sqft to accommodate the
growing business in EMS
1997
Diversified into Electronics Manufacturing Service
1996
Expanded the build up area to 88k sqft
1994
Accredited with ISO 9002 Quality Management System. Became a
subsidiary of KESM Industries Berhad (KESMI) which is listed in the
Malaysian Stock Exchange
1993
Expanded IC Burn-In Service to include LED
1992
Started LED Board Assembly Service for a world market leader in LED
1991
Expanded build up area to 40k sqft
1984
Started IC Burn-In Service for a major semiconductor company.
Initial build up area 18k sqft.
1983
The birth of KESP
