• 2018

    Ramping of LED burn-in and test.
  • 2017

    Transition from ISO/TS 16949:2009 to IATF 16949. Working towards Smart Burn In System
  • 2016

    Started High Power LED burn-in service for automotive lighting application
  • 2013

    Accredited with ISO14001:2004 Environmental Management System
  • 2011

    Started LED Test and Backend manufacturing service
  • 2006

    Upgraded to ISO/TS 16949:2002 certification. Started Sensor Module  Assembly used in printer
  • 2003

    Upgraded to ISO 9001:2000 certification. Started Chip-On-Board  assembly service
  • 2001

    Accredited with QS 9000 Quality Management System. Started LED Lighting Assembly using Metal Core PCB
  • 1998

    Increase build up area to 125k sqft to accommodate the  growing business in EMS
  • 1997

    Diversified into Electronics Manufacturing Service
  • 1996

    Expanded the build up area to 88k sqft
  • 1994

    Accredited with ISO 9002 Quality Management System. Became a  subsidiary of KESM Industries Berhad (KESMI) which is listed in the  Malaysian Stock Exchange
  • 1993

    Expanded IC Burn-In Service to include LED
  • 1992

    Started LED Board Assembly Service for a world market leader in LED
  • 1991

    Expanded build up area to 40k sqft
  • 1984

    Started IC Burn-In Service for a major semiconductor company.  Initial build up area 18k sqft.
  • 1983

    The birth of KESP